Yorba Linda, CA, United States of America

Louis Schirm, Iv

This inventor holds 1 USPTO granted patent. Top assignee: Isp Technologies, LLC. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louis Schirm, Iv. Retrieved from https://idiyas.com/inventor/louis-schirm-iv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Innovations of Louis Schirm, Iv

Introduction

Louis Schirm, Iv is an accomplished inventor based in Yorba Linda, California. He has made significant contributions to the field of electronics, particularly in the design of power bus terminator circuits. His innovative approach has led to the development of a circuit that enhances the efficiency of personal computers and similar devices.

Latest Patents

Louis Schirm, Iv holds a patent for a "Bus terminator circuit having RC elements." This invention is designed to maintain circuit termination pins at a pre-established voltage while minimizing power dissipation during steady-state operation. The circuit achieves this by utilizing high impedance resistors and low-value resistors, allowing for high-speed operation of AC switching transitions. The result is a remarkable reduction in power dissipation, achieving between 90% to 75% less than standard bus terminator circuits.

Career Highlights

Throughout his career, Louis has been associated with Isp Technologies, LLC, where he has applied his expertise in electronic circuit design. His work has been instrumental in advancing the efficiency and performance of electronic systems.

Collaborations

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Conclusion

Louis Schirm, Iv's innovative contributions to electronic circuit design exemplify the impact of creativity and technical expertise in the field. His patent for the bus terminator circuit showcases his commitment to enhancing technology while reducing power consumption.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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