Highland, NY, United States of America

Louis H Wirtz

This inventor holds 6 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1992-1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louis H Wirtz. Retrieved from https://idiyas.com/inventor/louis-h-wirtz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 139(Granted Patents)


Location History:

  • Highland, NY (US) (1992 - 1994)
  • Calverton, NY (US) (1995)

Company Filing History:


Years Active: 1992-1995

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6 patents (USPTO):Explore Patents

Title: Louis H Wirtz: Innovator in Electro-Mechanical Bonding

Introduction

Louis H Wirtz is a notable inventor based in Highland, NY (US). He has made significant contributions to the field of electro-mechanical bonding, holding a total of 6 patents. His work focuses on innovative methods that enhance the performance and reliability of electrical connections.

Latest Patents

Wirtz's latest patents include groundbreaking inventions that address the challenges in bonding conductively coated polymers. One of his notable patents is the "Structure and process for electro/mechanical joint formation." This invention describes a bonding method that joins multiple conductively coated polymers in a single operation. The method utilizes heat generation from a high-energy source, which is focused by an energy director. This process results in the fusing of both polymer and metal surfaces, creating a robust electrical and mechanical bond.

Another significant patent is related to "Structures for electrically conductive decals filled with inorganic." This invention pertains to new structures for decals, specifically electrically conductive decals filled with inorganic insulator material. Wirtz discloses various methods and processes for manufacturing these decals, which are designed to enhance their electrical conductivity.

Career Highlights

Louis H Wirtz is associated with the International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His expertise in electro-mechanical bonding has positioned him as a key figure in advancing technologies that require reliable electrical connections.

Collaborations

Wirtz has collaborated with notable coworkers, including Mark R Kordus and Mark S Schneider. These collaborations have further enriched his work and contributed to the development of innovative solutions in the field.

Conclusion

Louis H Wirtz is a distinguished inventor whose work in electro-mechanical bonding has led to significant advancements in the industry. His patents reflect a commitment to innovation and a deep understanding of the challenges in creating reliable electrical connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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