Dayton, OH, United States of America

Louis F Siegel

This inventor holds 1 USPTO granted patent. Top assignee: Ncr Corporation. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louis F Siegel. Retrieved from https://idiyas.com/inventor/louis-f-siegel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 45(Granted Patents)


Company Filing History:


Years Active: 1989

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Louis F. Siegel: Inventor of a Two-Ply Thermal Paper Process.

Introduction

Louis F. Siegel is an inventor associated with Dayton, Ohio, and NCR Corporation. His patent work addresses the construction of laminated thermal paper designed to remain together during printing while allowing the sheets to be separated afterward.

Latest Patents

Siegel is credited with 1 patent: “Two Ply Thermal Paper and Method of Making.” The invention describes a two-ply laminated record medium made by applying a thermally reactive coating to a base sheet and attaching a top sheet through wet lamination. The coating provides enough adhesion to keep the sheets together during printing, yet allows them to be separated with ease after printing.

Career Highlights

Siegel’s patent reflects a practical innovation in thermal recording media, balancing durability during use with convenient separation afterward. His work is associated with NCR Corporation.

Collaborations

The listed coworkers associated with Siegel include Maurice W. Lewis and Thomas J. Obringer.

Conclusion

Louis F. Siegel’s patented thermal-paper process combines reliable adhesion during printing with easy post-print separation, highlighting his contribution to laminated record media.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…