Temple, GA, United States of America

Louis Douglas Smith, Jr

This inventor holds 2 USPTO granted patents. Top assignee: Printpack Illinois, Inc.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louis Douglas Smith, Jr. Retrieved from https://idiyas.com/inventor/louis-douglas-smith-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023-2026

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2 patents (USPTO):Explore Patents

Title: Innovations of Louis Douglas Smith, Jr.

Introduction

Louis Douglas Smith, Jr. is an accomplished inventor based in Temple, GA (US). He has made significant contributions to the field of packaging materials, showcasing his innovative spirit through his patented inventions.

Latest Patents

Smith holds a patent for a unique packaging material with indicium in a metallic layer. This invention involves a laminate that includes first and second webs joined together. The first web features a metallic layer positioned between a second layer and the second web. The indicium is defined within the metallic layer, making it visible from one side of the packaging while typically remaining hidden from the other side. The design enhances the visibility of the indicium by incorporating materials of different colors, which can be partially seen through the indicium.

Career Highlights

Louis Douglas Smith, Jr. is currently employed at Printpack Illinois, Inc., where he continues to innovate in the packaging industry. His work has led to advancements that improve both functionality and aesthetics in packaging solutions.

Collaborations

Throughout his career, Smith has collaborated with notable colleagues, including John Ralph Bumgardner and Jeffery Allen Boekeloo. These partnerships have fostered a creative environment that encourages the development of new ideas and technologies.

Conclusion

Louis Douglas Smith, Jr. exemplifies the spirit of innovation in the packaging industry through his patented work and collaborations. His contributions continue to influence the field and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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