Louis Chun Wang is an accomplished inventor based in Raritan, NJ (US). He has made significant contributions to the field of polymer technology, particularly in the development of polyethylene molding powders. With a total of 6 patents to his name, Wang's work has had a notable impact on various applications in the industry.

Latest Patents

One of Wang's latest patents is focused on a new molding powder comprising polyethylene polymer particles. The molecular weight of the polyethylene polymer ranges from about 600,000 g/mol to about 2,700,000 g/mol, as determined by ASTM 4020. The average particle size of these polyethylene polymer particles is between 5 microns and 1000 microns, and the powder exhibits a bulk density ranging from about 0.10 to about 0.30 g/cc. This invention also includes a process for molding shapes from the polyethylene polymer particles, resulting in porous articles that demonstrate excellent porosity and good strength for filtration applications.

Career Highlights

Wang is currently associated with Ticona GmbH, where he continues to innovate and develop new materials. His expertise in polymer science has positioned him as a key player in the industry, contributing to advancements in material properties and applications.

Collaborations

Throughout his career, Wang has collaborated with notable colleagues, including Jens Ehlers and Stanislaw Haftka. These partnerships have fostered a collaborative environment that enhances the innovation process and leads to groundbreaking developments in polymer technology.

Conclusion

Louis Chun Wang's contributions to the field of polymer technology, particularly through his innovative polyethylene molding powders, highlight his role as a significant inventor. His work continues to influence various applications, showcasing the importance of innovation in material science.

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