Company Filing History:
Years Active: 1978-1991
Title: Innovations of Louis B Holdeman
Introduction
Louis B Holdeman is a notable inventor based in Boyds, MD (US), recognized for his contributions to microwave semiconductor technology. He holds three patents that showcase his expertise in the field of integrated circuits and packaging methods.
Latest Patents
One of his latest patents is a method of packaging microwave semiconductor components and integrated circuits. This innovation utilizes a motherboard made of high resistivity silicon, which has a thermal conductivity three times that of gallium arsenide. The use of ultra-high purity, uncompensated silicon is preferred. Anisotropic etching of recesses in the motherboard allows for precise placement of monolithic microwave integrated circuits (MMICs), enabling automated die and wire bonding techniques that significantly reduce assembly time. Additionally, the silicon motherboard effectively transmits RF energy, making it suitable for C-band and X-band applications.
Another significant patent is for a microwave integrated circuit designed for Josephson voltage standards. This circuit consists of one or more Josephson junctions and short sections of microstrip or stripline transmission line, fabricated from thin layers of superconducting metal on a dielectric substrate. The circuit includes two microwave resonators, with the Josephson junctions positioned between them. This design allows for precise voltage measurement, proportional to the frequency of the microwave drive signal.
Career Highlights
Throughout his career, Louis B Holdeman has worked with various companies, including Comsat Corporation. His work has significantly impacted the field of microwave technology, particularly in the development of integrated circuits.
Collaborations
He has collaborated with notable individuals such as Bernard D Geller and Johann U Tyler, contributing to advancements in microwave semiconductor technology.
Conclusion
Louis B Holdeman's innovative patents and career achievements highlight his significant contributions to the field of microwave technology. His work continues to influence advancements in integrated circuits and semiconductor packaging methods.