Other

Comsat Corporation

Louis B Holdeman

Robert A Frosch

Bernard D Geller

Fred R Phelleps

George F Laird, Iii

Johann U Tyler

Chu-Cheng Chang

Jaan Toots

Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise placement of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.

Method of packaging microwave semiconductor components and integrated

A microwave integrated circuit, comprised of one or more Josephson junctions and short sections of microstrip or stripline transmission line, is fabricated from thin layers of superconducting metal on a dielectric substrate. The short sections of transmission line are combined to form the elements of the circuit, and particularly, two microwave resonators. The Josephson junctions are located between the resonators, and the impedance of the Josephson junctions forms part of the circuitry that couples the two resonators. The microwave integrated circuit has an application in Josephson voltage standards. In this application, the device is asymmetrically driven at a selected frequency (approximately equal to the resonance frequency of the resonators), and a D.C. bias is applied to the junction. By observing the current-voltage characteristic of the junction, a precise voltage, proportional to the frequency of the microwave drive signal, is obtained.

Microwave integrated circuit for Josephson voltage standards

Method of producing porous copper workpieces and product thereof

Growing community of inventors

Boyds, MD, United States of America

Louis B Holdeman