Fort Worth, TX, United States of America

Louie Reynolds

This inventor holds 1 USPTO granted patent. Top assignee: Radioshack Corporation. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louie Reynolds. Retrieved from https://idiyas.com/inventor/louie-reynolds

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Louie Reynolds: Innovator in Device Packaging Assembly

Introduction

Louie Reynolds is a notable inventor based in Fort Worth, TX (US). He has made significant contributions to the field of device packaging assembly. With a focus on innovation, he has developed solutions that enhance the efficiency and effectiveness of packaging in the technology sector.

Latest Patents

Louie Reynolds holds a patent for a device packaging assembly. This invention showcases his ability to create practical solutions that meet the needs of modern technology companies. His patent is a testament to his innovative spirit and dedication to improving product packaging.

Career Highlights

Reynolds is currently associated with RadioShack Corporation, where he applies his expertise in packaging technology. His role at the company allows him to work on various projects that aim to streamline packaging processes and enhance product delivery.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Louie Reynolds is a talented inventor whose work in device packaging assembly has made a significant impact in the industry. His contributions continue to influence the way technology products are packaged and delivered.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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