This inventor holds 1 USPTO granted patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Loo L Teoh: Semiconductor Packaging Inventor
Introduction
Loo L Teoh is an inventor associated with Penang, Malaysia, and Advanced Micro Devices Corporation. His work includes an invention designed to support the assembly of organic and ceramic flip chip semiconductor packages.
Latest Patents
Teoh is credited with 1 patent: “Boat for Organic and Ceramic Flip Chip Package Assembly.” The invention describes a boat with through-holes that hold semiconductor packages securely during assembly. Its embodiments include layered structures with aligned openings that form package-holding pockets, as well as tabs that help retain packages. An alignment mechanism helps position components accurately on packages held in the boat.
Career Highlights
The patent reflects Teoh’s contribution to semiconductor packaging assembly, with a focus on securely holding packages and accurately positioning components during manufacturing. He is associated with Advanced Micro Devices Corporation.
Collaborations
Teoh’s listed coworkers include Ahmad Juwanda and Maria G. Guardado.
Conclusion
Loo L Teoh’s patent addresses practical challenges in flip chip package assembly by combining secure package retention with accurate component alignment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile