Company Filing History:
Years Active: 2025
Title: Innovations by Loan Bui in Cell Encapsulation Technology
Introduction
Loan Bui is an innovative inventor based in South Bend, IN (US). She has made significant contributions to the field of cell encapsulation technology. Her work focuses on enhancing the efficiency and effectiveness of encapsulating single cells, which has important implications for biomedical applications.
Latest Patents
Loan Bui holds a patent for a method of encapsulating single cells utilizing an alternating current electrospray. This method, described in her patent, achieves an encapsulation efficiency of over 80%. It employs alternating current electrospray technology in tip streaming mode. The technology allows for the use of both natural hydrogels, such as alginate and collagen, and synthetic hydrogels like NorHA. The encapsulated cells can be implanted and are protected from the host's immune response. Additionally, the coating facilitates better tissue growth in laboratory cell cultures by providing conformal mechanical support that allows for molecular and nutrient transport.
Career Highlights
Loan Bui is affiliated with the University of Notre Dame Du Lac, where she continues to advance her research in cell encapsulation. Her innovative approach has garnered attention in the scientific community, contributing to advancements in tissue engineering and regenerative medicine.
Collaborations
Loan Bui collaborates with Zehao Pan, who is also involved in research related to cell encapsulation and tissue engineering. Their partnership enhances the research output and fosters innovation in their respective fields.
Conclusion
Loan Bui's work in cell encapsulation technology represents a significant advancement in biomedical engineering. Her innovative methods and dedication to research continue to pave the way for future developments in the field.