Company Filing History:
Years Active: 2024
Title: Innovations by Lixin Qi in Strain Gauge Technology
Introduction
Lixin Qi is a prominent inventor based in Wuxi, China, known for his contributions to the field of strain gauge technology. With a total of two patents to his name, he has developed innovative methods that enhance the efficiency and stability of strain gauge circuits.
Latest Patents
Lixin Qi's latest patents include a novel direct-ink-writing (DIW) method for printing a strain gauge array circuit. This method involves layering the entire circuit using a 3D printing technique. A thin layer of insulating material is printed on the first circuit layer, creating a second insulating layer. A through hole is reserved for contact, ensuring that the functional layer of the strain gauge can connect with both circuit layers while maintaining insulation. This innovative approach effectively completes the printing of the array strain gauge and ensures measurement stability.
Another significant patent by Lixin Qi is the direct-ink-writing method for printing a strain gauge array circuit based on insulating strips. In this method, insulating strips are printed on the upper layer of the first circuit layer after it has been cured. The second circuit layer is then printed at the insulating strips, allowing the functional layer of the strain gauge to be printed without direct contact with the strips. This method enhances strain transmission efficiency from the substrate to the functional layer.
Career Highlights
Lixin Qi is affiliated with Jiangnan University, where he continues to advance research in innovative printing methods for electronic circuits. His work has significantly impacted the field of strain gauge technology, making it more efficient and reliable.
Collaborations
Lixin Qi collaborates with notable colleagues, including Peishi Yu and Junhua Zhao, who contribute to his research endeavors.
Conclusion
Lixin Qi's innovative approaches in strain gauge technology demonstrate his commitment to advancing the field through effective and efficient methods. His contributions are paving the way for future developments in electronic circuit printing.