The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Mar. 23, 2022
Jiangnan University, Wuxi, CN;
Junhua Zhao, Wuxi, CN;
Peishi Yu, Wuxi, CN;
Zhiyang Guo, Wuxi, CN;
Lixin Qi, Wuxi, CN;
Yu Liu, Wuxi, CN;
JIANGNAN UNIVERSITY, Wuxi, CN;
Abstract
A novel direct-ink-writing (DIW) method for printing a strain gauge array circuit is disclosed. Firstly, the whole circuit is layered by a 3D printing method; a thin layer of insulating material is printed on the first circuit layer, instead of printing an insulating bridge, to form the second insulating layer; a part needing to contact the second insulating layer is not printed, but one through hole is reserved; the second circuit layer is then printed; the functional layer of the strain gauge is finally covered; the electrodes on the functional layer can contact the second circuit layer or can contact the first circuit layer through the through holes, which ensures that the functional layer contacts the two circuit layers, and also ensures the insulation in a cross part of a matrix circuit; the printing of the array strain gauge is effectively completed; and the stability of measurement is ensured.