Company Filing History:
Years Active: 2022
Title: Lixiang Zhang: Innovator in Semiconductor Machining Technology
Introduction
Lixiang Zhang is an esteemed inventor based in Beijing, China, recognized for his significant contributions to the field of ultra-precision machining of semiconductor wafer materials. With a strong focus on enhancing manufacturing processes in semiconductor technology, Lixiang has developed an innovative solution that addresses the critical need for monitoring grinding forces during wafer processing.
Latest Patents
Lixiang Zhang holds a notable patent titled "Device and Method for On-Line Measurement of Wafer Grinding Force." This invention presents a sophisticated method and apparatus designed for the on-line measurement of wafer thinning and grinding force. The apparatus consists of several components, including a semiconductor wafer, a worktable, a bearing table, a thin film pressure sensor, and a data processing and wireless transmission module. The method outlines sensor calibration based on the testing device and allows for real-time monitoring of grinding forces throughout the semiconductor wafer grinding process. This innovative approach is pivotal for enhancing semiconductor processing efficiency and minimizing grinding-induced damage.
Career Highlights
Currently, Lixiang Zhang is affiliated with the Beijing University of Technology, where he continues his research and development in semiconductor technology. His work has a profound impact not only on academic knowledge but also on practical applications in the semiconductor industry, where precision and efficiency are paramount.
Collaborations
Lixiang collaborates with esteemed colleagues such as Fei Qin and Shuai Zhao, contributing to a dynamic research environment that fosters innovation in semiconductor processing technologies. Together, they work on advancing methods that ensure higher precision and lower risk in manufacturing processes, emphasizing the importance of teamwork in pushing technological boundaries.
Conclusion
Lixiang Zhang stands out as a key figure in the semiconductor research community, making strides in wafer grinding technology through his innovative patent. His commitment to developing advanced measurement techniques not only enhances the manufacturing process but also brings a significant positive impact to the semiconductor industry. As technology continues to evolve, the contributions of inventors like Lixiang Zhang will play a critical role in shaping the future of precision machining.
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