Company Filing History:
Years Active: 1997-1998
Title: Innovations in Bonding Pad Technology by Liu Ming-Tsung
Introduction
Liu Ming-Tsung is a notable inventor based in Hsin-Chu, Taiwan. With a focus on advancing semiconductor technology, he has made significant contributions to the field through his inventive processes and structures. Liu holds two patents that underscore his expertise and innovative approach in the domain of bonding pads.
Latest Patents
Liu's latest patents include a revolutionary "Method of forming a bonding pad" and "Bonding pad structure and method thereof." These patents detail a method for creating an improved bonding pad that enhances bonding between a bond wire and a metal bonding pad. The process involves forming stripes on a substrate, followed by a series of layers including a conformal dielectric layer, a conformal barrier layer, and a metal layer over the stripes. The innovations Liu proposes lead to an irregular surface in the barrier and metal layers, which effectively reduces stress between these layers. Additionally, the irregular surfaces improve adhesion and significantly increase the bonding yields, thereby enhancing the reliability and performance of semiconductor devices.
Career Highlights
Liu Ming-Tsung is affiliated with United Microelectronics Corporation, where he applies his knowledge and skills in semiconductor manufacturing. His career at this prominent company positions him at the forefront of semiconductor technology development, contributing to advancements that shape the industry.
Collaborations
Throughout his career, Liu has collaborated with esteemed colleagues such as Bill Y. Hsu and Hsien-Dar Chung. These collaborations have enriched his research and development efforts, fostering innovation through the exchange of ideas and expertise.
Conclusion
Liu Ming-Tsung exemplifies the spirit of innovation within the semiconductor industry. His patents on bonding pad technology not only reflect his ingenious approach to solving complex problems but also contribute to the ongoing advancements in semiconductor manufacturing. As technology continues to evolve, inventions like those of Liu serve as a foundation for future innovations.