Oak Park, IL, United States of America

Lisa Saxon-Reed

This inventor holds 1 USPTO granted patent. Top assignee: Wm Wrigley Jr Company. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lisa Saxon-Reed. Retrieved from https://idiyas.com/inventor/lisa-saxon-reed

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Lisa Saxon-Reed: Innovator in Packaging Solutions

Introduction

Lisa Saxon-Reed is a notable inventor based in Oak Park, Illinois. She has made significant contributions to the field of packaging with her innovative designs. Her work is particularly recognized for enhancing the functionality and convenience of packaging solutions.

Latest Patents

Lisa holds a patent for a hard shell, multi-article, reclosable package. This invention showcases her ability to combine practicality with user-friendly design, making it easier for consumers to access multiple items while ensuring freshness and quality.

Career Highlights

Lisa Saxon-Reed is currently employed at the Wm. Wrigley Jr. Company, where she continues to develop innovative packaging solutions. Her career is marked by a commitment to improving product accessibility and sustainability in packaging.

Collaborations

Throughout her career, Lisa has collaborated with talented individuals such as Paul J. Angeloni and Christopher H. Cunningham. These partnerships have allowed her to expand her creative horizons and contribute to successful projects within her company.

Conclusion

Lisa Saxon-Reed exemplifies the spirit of innovation in the packaging industry. Her contributions not only enhance consumer experience but also reflect her dedication to advancing packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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