Taipei, Taiwan

Lingwen Yeh

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lingwen Yeh. Retrieved from https://idiyas.com/inventor/lingwen-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Innovations by Lingwen Yeh

Introduction

Lingwen Yeh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electrical engineering, particularly with his innovative designs that enhance connectivity and user experience.

Latest Patents

Lingwen Yeh holds a patent for an "Electrical adapter for identifying the connection state to a network." This invention features a unique design that includes a first member with a male end resembling a connector plug, which connects to a wall outlet or female receptacle. The first member also has a first female end with a hollow cylinder and a display window. The second member includes a second female end equipped with a push latch and a mark for identifying the connection state to a network. This innovative adapter allows users to easily determine the connection status, enhancing usability and functionality.

Career Highlights

Lingwen Yeh is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field, contributing to various projects and innovations.

Collaborations

Some of his notable coworkers include Chun-Fei Chang and Tzuching Kuo. Their collaborative efforts have likely played a role in advancing the projects they have worked on together.

Conclusion

Lingwen Yeh's contributions to electrical engineering, particularly through his patented innovations, demonstrate his commitment to enhancing technology and connectivity. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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