Shenzhen, China

Lingling Wu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Huawei Technologies Co., Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lingling Wu. Retrieved from https://idiyas.com/inventor/lingling-wu-er6glxbu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lingling Wu: Inventor in Component Authentication

Introduction

Lingling Wu is an inventor based in Shenzhen, China, associated with Huawei Technologies Co., Ltd. The supplied information identifies her work in component authentication, a security process designed to verify a computer component before it is allowed to boot.

Latest Patents

The provided data lists 1 patent for Lingling Wu: “Component Authentication Method and Apparatus.” The invention describes a process in which, after a computer powers on, its baseboard management controller (BMC) initiates authentication with a component. The component then sends the BMC an access request containing its authentication certificate. If the BMC verifies the certificate successfully, it sends an access response, allowing the component to boot. This approach places authentication before startup and helps prevent unauthorized components from booting.

Career Highlights

Wu’s listed patent focuses on hardware security and trusted computer startup. Her work is associated with Huawei Technologies Co., Ltd., a technology company.

Collaborations

The supplied information names Xiaochuan Li and Chao Zhang as Wu’s coworkers. No further details about their roles or contributions to the patent were provided.

Conclusion

Lingling Wu’s listed invention addresses component security by requiring certificate verification before a computer component can boot.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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