Shanghai, China

Ling Ya

This inventor holds 1 USPTO granted patent. Top assignee: Schneider Electric Industries Sas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ling Ya. Retrieved from https://idiyas.com/inventor/ling-ya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ling Ya - Innovator in Busbar Technology

Introduction

Ling Ya is an innovative inventor based in Shanghai, China. She has made significant strides in the field of electrical engineering, particularly with her recent patent application. Although she currently holds no granted patents, her work demonstrates a commitment to advancing technology in her area of expertise.

Latest Patent Applications

Ling Ya's latest patent application is titled "BUSBAR CHAMBER ARC-STRIKING ASSEMBLY AND ELECTRIC CABINET." This invention discloses a busbar chamber arc-striking assembly that includes a main frame designed to accommodate a busbar chamber sleeve. The main frame features a back plate positioned on the side of the busbar chamber sleeve that is opposite to the busbar. Additionally, the assembly includes a first arc-striking plate that is parallel to and spaced apart from the back plate of the main frame. This first arc-striking plate is installed to extend between adjacent busbar chamber sleeves. The innovative design allows for quick arc striking at the initial stage of arc generation, effectively cutting off the arc, reducing arc energy, and igniting the arc itself until it is extinguished.

Conclusion

Ling Ya's contributions to the field of electrical engineering, particularly through her latest patent application, highlight her innovative spirit and dedication to improving technology. Her work in developing the busbar chamber arc-striking assembly showcases her potential as a leading inventor in her field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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