Linda Weitzel

Title: Linda Weitzel: Innovator in Electronic Packaging

Introduction

Linda Weitzel is a notable inventor based in Barrington, IL (US). She has made significant contributions to the field of electronic packaging, particularly through her innovative solder connection technologies. With a total of 2 patents, her work has had a substantial impact on the industry.

Latest Patents

One of Linda's latest patents is focused on a tin-zinc solder connection to a printed circuit board. This electronic package features a component mounted on a substrate, such as a printed circuit board, using a solder connection based on a tin alloy containing zinc. The connection is formed to a copper faying surface on the substrate and includes a first layer made of zinc-free tin metal bonded to the copper surface. Additionally, a second layer formed of the tin-zinc solder alloy is bonded to the first layer. The first layer serves as a zinc-free barrier between the copper and the tin-zinc alloy, effectively retarding zinc migration to the copper interface. This innovation prevents dezincification of the solder alloy, thereby preserving the mechanical properties of the connection.

Career Highlights

Linda Weitzel has had a distinguished career at Motorola Corporation, where she has been instrumental in developing advanced electronic packaging solutions. Her expertise in solder connections has positioned her as a leader in her field.

Collaborations

Throughout her career, Linda has collaborated with various professionals, including her coworker Cynthia M Melton. Their joint efforts have contributed to the advancement of technology in electronic packaging.

Conclusion

Linda Weitzel's innovative work in solder connection technology has made her a prominent figure in the field of electronic packaging. Her contributions continue to influence the industry and pave the way for future advancements.