Pittsburgh, PA, United States of America

Lin Jing

This inventor holds 2 USPTO granted patents. Top assignee: Carnegie Mellon University. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lin Jing. Retrieved from https://idiyas.com/inventor/lin-jing-snhavks6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: Lin Jing: Innovator in Thermal Interface Technology

Introduction

Lin Jing is a prominent inventor based in Pittsburgh, PA (US). He has made significant contributions to the field of thermal interface materials, holding a total of 2 patents. His work focuses on enhancing the performance of thermal interfaces through innovative designs.

Latest Patents

One of Lin Jing's latest patents is a nanowire-based thermal interface. This high-performance thermal interface comprises a nanowire array disposed between a bottom metal layer and a top metal layer. Each nanowire is coated with a 3D fuzzy graphene layer, which enhances its thermal conductivity. The thermal interface can be effectively used by bonding it to the surfaces of adjoining substrates using layers of solder. This innovative design aims to improve heat dissipation in various applications.

Career Highlights

Lin Jing is affiliated with Carnegie Mellon University, where he conducts research and develops new technologies. His work has garnered attention for its potential applications in electronics and other industries that require efficient thermal management.

Collaborations

Lin Jing has collaborated with notable colleagues, including Sheng Shen and Wei Gong. These partnerships have contributed to the advancement of his research and the development of new technologies in the field.

Conclusion

Lin Jing is a dedicated inventor whose work in thermal interface technology is paving the way for advancements in heat management solutions. His innovative patents and collaborations highlight his commitment to improving performance in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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