This inventor holds 2 USPTO granted patents. Top assignee: Quanta Computer Incorporated. Active years: 2015-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015-2018
Title: Lin-Huei Wang: Innovator in Substrate Bonding and Thermal Curing Technologies
Introduction
Lin-Huei Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of substrate bonding and thermal curing technologies. With a total of 2 patents to his name, Wang continues to push the boundaries of innovation in his industry.
Latest Patents
Wang's latest patents include a substrate-bonding device and a method of the same. This method involves several steps, including providing a curved glass substrate and a flexible light-transmissive film. The process requires moving a roller to press the flexible light-transmissive film onto the curved glass substrate, ensuring that it matches the curvature for a proper bond. Additionally, the method includes sensing the attaching level of the film and adjusting the press force accordingly. Another significant patent is the glue-thermal curing equipment, which consists of a chassis, a support, a heating baking plate, and a lifting device. This equipment is designed to provide uniform thermal energy to a liquid-state glue layer on a panel device, enhancing the curing process.
Career Highlights
Lin-Huei Wang is currently employed at Quanta Computer Incorporated, a leading technology company. His work focuses on developing innovative solutions that improve manufacturing processes and product quality. Wang's expertise in substrate bonding and thermal curing has positioned him as a key player in his field.
Collaborations
Wang collaborates with talented individuals such as Lai-Peng Lai and Ching-Chih Chen, who contribute to his projects and innovations. Their teamwork fosters a creative environment that enhances the development of new technologies.
Conclusion
Lin-Huei Wang's contributions to substrate bonding and thermal curing technologies exemplify his commitment to innovation. His patents reflect a deep understanding of the technical challenges in his field, and his work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile