Lin Chia-Chieh

Title: Lin Chia-Chieh: Innovator in 3DIC Interconnect Technology

Introduction

Lin Chia-Chieh is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of interconnect apparatuses. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this specialized area.

Latest Patents

Lin Chia-Chieh holds a patent for a 3DIC interconnect apparatus and method. This invention provides a novel approach to bonding two substrates, such as wafers or dies. The method involves using a first mask to create an opening that partially extends to an interconnect on the first wafer. A dielectric liner is then formed, followed by an etch process that exposes interconnects on both substrates. Finally, the opening is filled with a conductive material to create a conductive plug. This patent highlights Lin's innovative thinking and technical skills in semiconductor design.

Career Highlights

Lin Chia-Chieh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing. His dedication to innovation has positioned him as a valuable asset in his field.

Collaborations

Lin has collaborated with notable colleagues, including Shih Pei Chou and Hung-Wen Hsu. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further enhancing the quality of their work.

Conclusion

Lin Chia-Chieh is a distinguished inventor whose contributions to 3DIC interconnect technology have made a significant impact in the semiconductor industry. His innovative patent and collaborative efforts with colleagues reflect his commitment to advancing technology. Lin's work continues to inspire future innovations in the field.