Limei Cui

Title: The Innovative Contributions of Limei Cui

Introduction

Limei Cui is a notable inventor based in Shanghai, China. He has made significant contributions to the field of telecommunications and data networking hardware. His work focuses on enhancing the efficiency of electronic devices through innovative thermal management solutions.

Latest Patents

Limei Cui holds a patent for a "Thermal interface structure for optical transceiver modules." This invention addresses the need for efficient heat transfer in electronic devices that utilize optical transceiver modules. The thermal interface structure is strategically placed between the optical transceiver module and a heat sink, ensuring optimal thermal performance. The design includes a thermal interface layer made of phase change material, along with a polymer layer that enhances its functionality.

Career Highlights

Cui is currently employed at Honeywell International Inc., where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of optical transceiver modules, which are critical components in modern telecommunications.

Collaborations

Limei Cui has collaborated with talented coworkers, including Kai Zhang and Ling Shen, who contribute to the innovative environment at Honeywell. Their combined expertise fosters a culture of creativity and technological advancement.

Conclusion

Limei Cui's contributions to the field of thermal management in electronic devices exemplify the importance of innovation in technology. His patent and ongoing work at Honeywell International Inc. highlight his role as a key player in the advancement of telecommunications hardware.