Company Filing History:
Years Active: 2020
Title: Lihui Lu: Innovator in Semiconductor Technologies
Introduction
Lihui Lu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technologies, particularly through his innovative patent related to wafer dicing methods. His work has implications for improving the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents
Lihui Lu holds a patent for a wafer dicing method. This disclosure provides wafer dicing methods and relates to the field of semiconductor technologies. Implementations of the dicing method may include performing laser stealth dicing processing on a wafer from the back surface of the wafer. Additionally, it involves performing grinding and thinning processing on the back surface of the wafer after the laser stealth dicing processing. The method also includes sticking a dicing tape on the back surface of the wafer after the grinding and thinning processing, followed by performing separation processing on the wafer after sticking the dicing tape. In some implementations, stealth dicing (SD) is performed before grinding, allowing a laser to be directly imposed on the back surface of a wafer. This approach alleviates a laser attenuation problem and lowers the requirements on light transmittance of a dicing tape.
Career Highlights
Lihui Lu has worked with notable companies in the semiconductor industry, including Semiconductor Manufacturing International (Beijing) Corporation and Semiconductor Manufacturing International (Shanghai) Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovation.
Collaborations
Lihui Lu has collaborated with several professionals in his field, including Chunchao Fei and Po Yuan Chiang. These collaborations have likely enhanced his research and development efforts in semiconductor technologies.
Conclusion
Lihui Lu is a key figure in the semiconductor industry, with a focus on innovative wafer dicing methods. His contributions are vital for advancing semiconductor manufacturing processes and improving overall efficiency.