Shanghai, China

Lihua Liu

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Ocv Intellectual Capital, LLC. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lihua Liu. Retrieved from https://idiyas.com/inventor/lihua-liu-kdb2p5wi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Lihua Liu: Innovator in Multi-Axial Fabrics

Introduction

Lihua Liu is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of materials science, particularly in the development of multi-axial fabrics and polymer-fiber laminates. Her innovative work has the potential to enhance performance and reduce costs in various connecting applications.

Latest Patents

Lihua Liu holds a patent for "Multi-axial fabrics, polymer-fiber laminates, and bodies incorporating same for connecting applications." This patent discloses multi-axial fabrics, including hybrid varieties, and polymer-fiber laminates. The bodies that incorporate these fabrics and laminates exhibit improved performance and reduced costs for connecting applications.

Career Highlights

Lihua Liu is currently associated with Ocv Intellectual Capital, LLC, where she continues to push the boundaries of innovation in her field. Her work is characterized by a commitment to developing advanced materials that meet the demands of modern engineering and manufacturing.

Collaborations

Throughout her career, Lihua has collaborated with notable professionals, including Georg Adolphs and Christopher John Skinner. These collaborations have further enriched her research and development efforts.

Conclusion

Lihua Liu's contributions to the field of multi-axial fabrics and polymer-fiber laminates highlight her role as a leading innovator. Her work not only advances material science but also opens new avenues for cost-effective solutions in connecting applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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