Beijing, China

Lifeng Gao

This inventor holds 3 USPTO granted patents and 3 published patent applications. Top assignee: Beijing Roborock Technology Co., Ltd.. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lifeng Gao. Retrieved from https://idiyas.com/inventor/lifeng-gao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2023-2025

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Lifeng Gao - Pioneering Inventor from Beijing, CN

Introduction: Lifeng Gao is a distinguished inventor hailing from Beijing, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Lifeng Gao holds several patents in the areas of artificial intelligence, renewable energy, and advanced materials, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Lifeng Gao has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Lifeng Gao has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to numerous breakthroughs in the industry.

Conclusion: Lifeng Gao's passion for innovation, coupled with his relentless drive to solve complex challenges, has solidified his reputation as a trailblazer in the world of invention. His work continues to inspire future generations of inventors to think boldly and push the limits of what technology can achieve.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…