Company Filing History:
Years Active: 2013-2015
Title: The Innovative Journey of Liew Siew Har
Introduction
Liew Siew Har, an accomplished inventor based in Ipoh, Malaysia, has made significant strides in the field of semiconductor technology. With a total of four patents to his name, his work focuses mainly on advancing wire bonding techniques used in multi-die packages, which are essential components in the manufacturing of modern electronic devices.
Latest Patents
Among Liew's most notable inventions are two cutting-edge patents related to wire bonding. The first, "Short and Low Loop Wire Bonding," describes a multi-die package that includes both a first and a second semiconductor die. This innovation features a unique bonding wire design that incorporates a kink at a specific height above the connecting plane, along with strategic humps that facilitate effective electrical connections between the bond pads of the two semiconductor dies.
The second patent, "Low Loop Wire Bonding," presents a similar multi-die package configuration but emphasizes a bonding wire that extends upward along the z-axis before curving towards the first semiconductor die, enhancing flexibility and performance in semiconductor designs.
Career Highlights
Liew Siew Har currently works with Carsem (M) Sdn. Bhd., a prominent player in the semiconductor packaging and testing industry. His role there has allowed him to apply his innovative ideas toward developing effective solutions that meet the evolving demands of electronic manufacturing. His contributions not only reflect his technical prowess but also highlight his commitment to driving advancements in this crucial sector.
Collaborations
In his pursuit of innovation, Liew collaborates closely with his coworker, Law Wai Ling. Together, they have combined their expertise to foster an environment of creativity and technical excellence, enabling them to tackle complex challenges in semiconductor technology.
Conclusion
Liew Siew Har stands out as a dedicated inventor whose contributions have the potential to significantly impact the field of semiconductor manufacturing. With a strong patent portfolio and a commitment to innovation, he continues to pave the way for new technological advancements. His work exemplifies the importance of collaboration and creativity in driving progress, ensuring that the future of electronics remains bright.