Lien Hsin Lee

Title: Lien Hsin Lee: Innovator in Touch Assembly Technology

Introduction

Lien Hsin Lee is a notable inventor based in Xiamen, China. He has made significant contributions to the field of touch assembly technology. His innovative approach has led to the development of a unique patent that enhances the functionality and manufacturing process of touch assemblies.

Latest Patents

Lien Hsin Lee holds a patent for a "Touch assembly and method of manufacturing the same." This invention includes a protective cover, a first adhesive layer, a plurality of curved wires, and a second adhesive layer. The first adhesive layer is strategically placed on the protective cover, with a thickness ranging from 20 μm to 200 μm. The initial tack of this layer varies from 1800 gf/in to 4000 gf/in. The curved wires are arranged on the first adhesive layer, consisting of two groups that extend in different directions and overlap each other. Each wire features a conductive inner core and a covering layer, while the second adhesive layer encapsulates both the curved wires and the first adhesive layer. This innovative design improves the efficiency and effectiveness of touch assemblies.

Career Highlights

Lien Hsin Lee is currently employed at Tpk Glass Solutions (Xiamen) Inc. His work at this company has allowed him to focus on advancing touch technology. With a patent portfolio that includes one patent, he has established himself as a key player in the industry.

Collaborations

Lien has collaborated with talented coworkers, including Jie Lin Hung and Li Huang Tsai. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Lien Hsin Lee's contributions to touch assembly technology exemplify the spirit of innovation. His patent reflects a commitment to enhancing user experience through advanced design and manufacturing methods. His work continues to influence the industry and inspire future advancements.