Beijing, China

Liedong Wang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Hangzhou Dareruohan Technology Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liedong Wang. Retrieved from https://idiyas.com/inventor/liedong-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations of Liedong Wang in Heat Dissipation Technology

Introduction

Liedong Wang is a notable inventor based in Beijing, China. He has made significant contributions to the field of heat dissipation technology, particularly in the design of systems that enhance the efficiency of chip and server cooling.

Latest Patents

Liedong Wang holds a patent for a heat dissipation plate designed for chip heat dissipation, a server heat dissipation system, and a heating device. The patent describes a heat dissipation plate where one end may be blocked, while the other end is equipped with a water inlet and a water outlet. The innovative design includes a pipeline assembly that features multiple branch water inlet and outlet pipelines, ensuring effective heat management in electronic devices.

Career Highlights

Liedong Wang is currently associated with Hangzhou Dareruohan Technology Co., Ltd., where he continues to develop advanced technologies in heat dissipation. His work is crucial in improving the performance and longevity of electronic components.

Collaborations

Liedong Wang collaborates with talented professionals in his field, including Risheng Li and Yunfeng Liu. Their combined expertise contributes to the innovative projects at their company.

Conclusion

Liedong Wang's contributions to heat dissipation technology exemplify the importance of innovation in enhancing electronic device performance. His patent and ongoing work reflect a commitment to advancing technology in this critical area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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