This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Technologies Co., Limited. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Libin Ding: Inventor of a High-Density Service Board Design
Introduction
Libin Ding is an inventor associated with Dongguan, China, and Huawei Technologies Co., Ltd. His patent work includes a service-board design intended to support high-density, high-speed communication systems.
Latest Patents
Ding is associated with 1 patent: “Service board and communication device.” The invention describes a service board with a flexible board, one or more chips, and optical cage layers containing multiple optical cages. Each cage has an opening for connecting an optical module and includes a housing and signal pins. The flexible board connects the signal-pin ends to a chip, shortening the connection path between the optical module and the chip. This design aims to reduce link loss, simplify assembly, improve integration, and enable high-density connections for high-speed transmission.
Career Highlights
Ding’s listed patent work is associated with Huawei Technologies Co., Ltd. The service-board invention addresses the physical connection between optical modules and chips, with a focus on compact integration and signal transmission.
Collaborations
Xiang Guo and Hang Yan are identified as Ding’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Libin Ding’s patent on a service board and communication device presents a design aimed at reducing link loss while supporting compact, high-density, high-speed communication systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile