Beijing, China

Liang Yan

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2012-2025

where 'Filed Patents' based on already Granted Patents

4 patents (USPTO):

Title: The Innovations of Liang Yan

Introduction

Liang Yan is a prominent inventor based in Beijing, China. He has made significant contributions to the field of electronics, particularly in the development of advanced communication devices. With a total of 4 patents, his work showcases a blend of creativity and technical expertise.

Latest Patents

Liang Yan's latest patents include an electronic device for performing precoding and a method for operating the same. This electronic device features a Radio Frequency Integrated Circuit (RFIC) that converts data from a communication processor into a radio frequency signal. The device is designed to identify the uplink channel based on a reference signal received from a base station (BS) and to precode uplink data for transmission. Another notable patent involves the development of electrically conductive particles and adhesives, which consist of a core microsphere encapsulated by a conductive macromolecular layer and a 3D graphene layer, enhancing their electrical properties.

Career Highlights

Throughout his career, Liang Yan has worked with leading companies such as Beijing BOE Optoelectronics Technology Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the electronics sector.

Collaborations

Liang has collaborated with notable professionals in his field, including Yubo Xu and Bongyeol Ryu. These partnerships have fostered a creative environment that has led to the development of innovative technologies.

Conclusion

Liang Yan's contributions to the field of electronics through his patents and collaborations highlight his role as a key innovator. His work continues to influence advancements in communication technology and materials science.

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