Shanghai, China

Liang Ouyang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovations of Liang Ouyang

Introduction

Liang Ouyang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of micro-fabrication technology. His work focuses on improving processes that enhance the efficiency and reliability of semiconductor manufacturing.

Latest Patents

Liang Ouyang holds a patent for a "System and method of sensing and removing residual charge from a processed wafer." This innovative system addresses the issue of de-chucking failures that can lead to the breakage or damage of wafers. The method involves applying a reverse polarity discharging DC voltage to an electrode embedded in an electrostatic chuck (ESC) that supports the wafer. This process effectively removes residual charge by providing an outlet to ground via a lift pin assembly. The lift pin assembly is maintained at the same potential as the ESC pedestal to prevent sparking during RF power application for plasma generation. Additionally, a residual charge sensor is incorporated to measure the amount of residual charge, allowing for adjustments in the reverse polarity discharging voltage during subsequent de-chucking operations.

Career Highlights

Liang Ouyang is currently employed at Advanced Micro-Fabrication Equipment, Inc. Asia. His role involves developing advanced technologies that enhance the performance of semiconductor manufacturing equipment. His expertise in micro-fabrication has positioned him as a key player in the industry.

Collaborations

Liang has collaborated with several talented individuals in his field, including Tuqiang Q Ni and Jinyuan Chen. These collaborations have contributed to the advancement of technologies in micro-fabrication and semiconductor processing.

Conclusion

Liang Ouyang's innovative work in the field of micro-fabrication has led to significant advancements in semiconductor manufacturing processes. His patent for removing residual charge from processed wafers exemplifies his commitment to improving technology in this critical industry.

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