Beijing, China

Liang Liang Dai

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liang Liang Dai. Retrieved from https://idiyas.com/inventor/liang-liang-dai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019-2021

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2 patents (USPTO):Explore Patents

Title: Innovations by Liang Liang Dai

Introduction

Liang Liang Dai is a notable inventor based in Beijing, China. He has made significant contributions to the field of electronic communication management. With a total of 2 patents to his name, his work focuses on enhancing communication systems for users.

Latest Patents

Liang Liang Dai's latest patents include methods, systems, and computer program products designed to improve a variety of electronic communication systems. These innovations aim to provide data regarding specific projects and link this data with multiple electronic communication systems. This approach enhances the overall communication experience for users.

Career Highlights

Liang Liang Dai is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to further develop his innovative ideas and contribute to advancements in technology.

Collaborations

Some of his coworkers include Li Li Gu and Jing Bo Jiang. Their collaboration fosters a creative environment that encourages the development of new ideas and solutions.

Conclusion

Liang Liang Dai's contributions to electronic communication management demonstrate his commitment to innovation and technology. His patents reflect a deep understanding of user needs and the potential for improved communication systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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