Liang Jen Koh

Title: The Innovations of Liang Jen Koh

Introduction

Liang Jen Koh is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of integrated circuits, showcasing his expertise through his innovative patent. His work is particularly relevant in the realm of electronics and semiconductor technology.

Latest Patents

Liang Jen Koh holds a patent for a "Bonding pad for a packaged integrated circuit." This invention involves a package substrate that features a regular array of connection points on its bottom side and an integrated circuit on its top side. The design includes vias that provide electrical connections between the two sides. Notably, the vias have a via capture pad that allows for direct wire bonding, eliminating the need for traces from a top side bond pad. The unique shape of the via capture pad, which includes at least one sharp edge, enhances the wirebonder's ability to locate the capture pad accurately.

Career Highlights

Liang Jen Koh is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative solutions in the semiconductor industry. His work has contributed to advancements in integrated circuit packaging, which is crucial for modern electronic devices.

Collaborations

Liang has collaborated with several talented individuals in his field, including Lan Chu Tan and Fuaida Harun. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Liang Jen Koh's contributions to the field of integrated circuits through his patent demonstrate his commitment to innovation and excellence. His work at Freescale Semiconductor, Inc. continues to impact the electronics industry positively.