Company Filing History:
Years Active: 2024-2025
Title: Innovations of Liang Chun Chen in Semiconductor Technology
Introduction
Liang Chun Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of encapsulation warpage reduction for semiconductor die assemblies. His innovative work has led to the development of methods and systems that enhance the reliability and performance of semiconductor devices.
Latest Patents
Liang Chun Chen holds a patent titled "Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems." This patent discloses a semiconductor die assembly that includes an interface die and a stack of semiconductor dies attached to its surface. The assembly features an encapsulant that surrounds the stack of semiconductor dies, designed with a unique sidewall structure that reduces warpage. The encapsulant's first portion extends to a height less than that of the semiconductor dies, while the second portion reaches the same height, each having distinct textures that contribute to the overall performance of the assembly.
Career Highlights
Liang Chun Chen is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to collaborate with other talented professionals, including his coworker Brandon P Wirz. Together, they contribute to advancing semiconductor technologies and improving product reliability.
Collaborations
Due to space limitations, the details of collaborations will not be included.
Conclusion
Liang Chun Chen's innovative contributions to semiconductor technology, particularly through his patent on encapsulation warpage reduction, highlight his expertise and commitment to advancing the field. His work at Micron Technology Incorporated continues to influence the development of reliable semiconductor devices.