Company Filing History:
Years Active: 2021
Title: Innovations of Liang-Chun Chen in Semiconductor Technology.
Introduction
Liang-Chun Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing semiconductor package structures and manufacturing methods.
Latest Patents
One of his latest patents is titled "Semiconductor package structure and method for manufacturing the same." This patent discloses a semiconductor package structure that includes a redistribution layer (RDL) structure, an electronic device, a first reinforcement structure, a second reinforcement structure, and an encapsulant. The RDL structure features a passivation layer and a patterned conductive layer. The electronic device is positioned on the RDL structure, while the first and second reinforcement structures provide varying moduli for enhanced stability. The encapsulant serves to protect the electronic device and the reinforcement structures.
Another significant patent is "Semiconductor package device and method of forming package body." This invention provides an apparatus for packaging a semiconductor device, which includes a first mold, a second mold, and a support element. The first mold consists of a plate, while the second mold features a carrier that defines a hole for supporting an object to be molded. This innovative approach streamlines the packaging process for semiconductor devices.
Career Highlights
Liang-Chun Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative mindset have positioned him as a key player in the industry.
Collaborations
Throughout his career, Liang-Chun Chen has collaborated with talented individuals such as Fan-Yu Min and Chen-Hung Lee. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Liang-Chun Chen's contributions to semiconductor technology through his patents and collaborations highlight his importance in the field. His innovative approaches continue to shape the future of semiconductor packaging.