Murray, UT, United States of America

Lia Packer

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Gyre & Gimble Gidgets Inc.. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lia Packer. Retrieved from https://idiyas.com/inventor/lia-packer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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2 patents (USPTO):Explore Patents

Title: Lia Packer - Innovator in Sensory Technology

Introduction

Lia Packer is a notable inventor based in Murray, UT (US). She has made significant contributions to the field of sensory devices, showcasing her innovative spirit and dedication to enhancing user experiences.

Latest Patents

Lia Packer holds a patent for a textured sensory device. This device features a bottom surface, a perimeter wall extending upward to a specific height, and a variety of projections that extend upward from the bottom surface. The projections are categorized into three distinct sets, each with a unique structure. These projections can take various forms, including cylindrical shapes, linear arrangements, concentric circular segments, or coupled linear segments. Her invention aims to provide diverse sensory experiences through its innovative design.

Career Highlights

Lia has established herself as a key player in her field, working with Gyre & Gimble Gidgets Inc. Her work reflects a commitment to advancing technology that enhances sensory interaction.

Collaborations

Lia collaborates with her coworker, Edward Packer, contributing to the development of innovative sensory solutions.

Conclusion

Lia Packer's contributions to sensory technology through her patent demonstrate her innovative capabilities and commitment to improving user experiences. Her work continues to inspire advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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