This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Inergy Technology Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Li-Zheng Lin and Semiconductor Package Innovation.
Introduction
Li-Zheng Lin is an inventor associated with Hsinchu, Taiwan, and Inergy Technology Inc. His patent work includes a semiconductor package designed around chip connections and lead-frame assemblies.
Latest Patents
The provided information identifies one patent for Lin: “Semiconductor package.” The disclosure describes a chip with opposing drain and source surfaces, along with drain and source lead-frame assemblies. Each assembly integrates its contact plate, connecting section, and leads into one piece. The drain contact plate connects to the chip’s drain surface and has a larger area than that surface, while the source contact plate connects to the source surface and has a smaller area. An insulation layer encapsulates the chip and surrounds both contact plates. Lin is credited with 1 patent.
Career Highlights
Lin’s listed patent focuses on semiconductor packaging and the arrangement of electrical contacts, lead frames, and insulation around a chip. The provided information associates him with Inergy Technology Inc.
Collaborations
Lan-Wei Wen is identified as Lin’s coworker. The available information does not specify whether Wen collaborated on the patent.
Conclusion
Li-Zheng Lin’s listed invention addresses semiconductor package construction through integrated lead-frame assemblies and carefully sized contact plates.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile