This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Flex Ltd.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: The Innovative Contributions of Li Yao in Microelectronics
Introduction: Li Yao, an inventive engineer based in Pudong, China, has made significant strides in the field of microelectronics. His innovative solutions are reflected in his patented technology, which aims to enhance the efficiency and performance of electronic components.
Latest Patents: One of Li Yao's notable inventions is the patent for an "Embedded copper structure for microelectronics package." This patent describes an electronic component and a method for its manufacturing. It involves the surface mounting of electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB, and underfilling the flip-chip IC to provide stability. Additionally, the method incorporates sintering a copper block to the PCB, which serves as a thermal path for dissipating heat generated by the flip-chip IC, ensuring the effective performance of the electronic package.
Career Highlights: Currently, Li Yao is affiliated with Flex Ltd., a prominent company in the electronics manufacturing sector. His work focuses on advancing microelectronic applications, which are crucial for a wide range of devices in today's technology-driven world. With one patent to his name, Yao's contributions illustrate his commitment to innovation in electronic design.
Collaborations: In his role at Flex Ltd., Li Yao collaborates with talented coworkers, including Cheng Yang and Dongkai Shangguan. These partnerships foster a creative environment that cultivates further innovations and deepens the exploration of advanced electronic solutions.
Conclusion: Li Yao represents the spirit of innovation in the microelectronics field. His patent for an embedded copper structure highlights the importance of effective thermal management in electronic components. Through his work at Flex Ltd. and collaboration with skilled colleagues, Yao continues to push the boundaries of technology, paving the way for future advancements in microelectronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile