Company Filing History:
Years Active: 2025
Title: Innovations by Li Wern Chew in Electrical Performance
Introduction
Li Wern Chew is an accomplished inventor based in Penang, Malaysia. She has made significant contributions to the field of electrical engineering, particularly in the design of printed circuit board assemblies. Her innovative work focuses on enhancing electrical performance through advanced interconnect designs.
Latest Patents
Li Wern Chew holds a patent for a "Vertical interconnect design for improved electrical performance." This patent describes a printed circuit board assembly that includes a circuit board with a first surface and an opposing second surface. The assembly features a first interconnect barrel that extends between these surfaces, incorporating a first section and a second section separated by a gap. This design aims to optimize electrical performance in circuit board applications.
Career Highlights
Li Wern Chew is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. Her role at Intel allows her to work on cutting-edge technologies that shape the future of electronics.
Collaborations
Li Wern Chew collaborates with talented colleagues, including Jackson Chung Peng Kong and Bok Eng Cheah. These partnerships foster a creative environment that enhances the development of innovative solutions in their field.
Conclusion
Li Wern Chew's contributions to electrical engineering through her patent and work at Intel Corporation highlight her role as a key innovator in the industry. Her dedication to improving electrical performance continues to influence advancements in technology.