Li Ting Celina Ong

Title: Innovations of Li Ting Celina Ong in Semiconductor Technology

Introduction

Li Ting Celina Ong is a notable inventor based in Kuala Lumpur, Malaysia. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a patented device that enhances the efficiency and functionality of semiconductor applications.

Latest Patents

Li Ting Celina Ong holds a patent for a bonded wire semiconductor device. This device includes a sub-assembly featuring a semiconductor die with an active face that contains a set of internal electrical contact elements. Additionally, it has an externally exposed set of electrical contact elements. The device utilizes a set of bond wires to create electrical connections between these internal and external elements. A molding compound encapsulates the semiconductor die, ensuring that the active face is embedded within it. The bond wires are designed to be of equal length and are bonded to the internal and external electrical contact elements at first and second curved arrays of bond positions, which have corresponding concentric shapes.

Career Highlights

Li Ting Celina Ong is currently employed at Freescale Semiconductor, Inc., where she continues to innovate in the semiconductor industry. Her work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Some of her coworkers include Yin Kheng Au and Zi-Song Poh, who contribute to the collaborative environment at Freescale Semiconductor, Inc.

Conclusion

Li Ting Celina Ong's contributions to semiconductor technology through her innovative patent demonstrate her expertise and commitment to advancing the field. Her work continues to impact the industry positively.