Company Filing History:
Years Active: 2003-2014
Title: Innovations of Li-Chung Liu in Chemical Mechanical Polishing Systems
Introduction
Li-Chung Liu is a notable inventor based in Taichung, Taiwan, recognized for his contributions to the field of chemical mechanical polishing (CMP) systems. With a total of four patents to his name, Liu has made significant advancements that enhance the efficiency and effectiveness of wafer polishing processes.
Latest Patents
Liu's latest patents include innovative designs for CMP systems. One of his patents describes a CMP system that features a wafer polishing unit equipped with a waste liquid sink for receiving used slurry and a waste slurry drain piping for efficient drainage. This system is coupled with a post-CMP cleaning unit that allows for real-time washing of the waste slurry drain piping on a wafer-by-wafer basis using a used base chemical such as tetramethyl ammonium hydroxide (TMAH). Another patent outlines a CMP system that includes a slurry treatment system designed to treat used slurry, producing an extracted basic solution. This solution is utilized by a post-CMP cleaning unit that incorporates rollers for wafer support and rotation, a brush for scrubbing, and a spray bar for applying the extracted solution to the polished wafer surface.
Career Highlights
Li-Chung Liu is currently employed at Nan Ya Technology Corporation, where he continues to innovate and develop advanced CMP technologies. His work has significantly impacted the semiconductor manufacturing industry, providing solutions that improve the quality and efficiency of wafer processing.
Collaborations
Liu collaborates with talented individuals such as Yi-Nan Chen and Hsien-Wen Liu, who contribute to the innovative environment at Nan Ya Technology Corporation. Their teamwork fosters creativity and drives the development of cutting-edge technologies in the field.
Conclusion
Li-Chung Liu's contributions to chemical mechanical polishing systems exemplify the importance of innovation in the semiconductor industry. His patents reflect a commitment to enhancing wafer processing techniques, making him a key figure in this technological domain.
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