The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
May. 12, 2011
Applicants:
Li-chung Liu, Taichung, TW;
Yi-nan Chen, Taipei, TW;
Hsien-wen Liu, Taoyuan County, TW;
Inventors:
Assignee:
Nanya Technology Corp., Kueishan, Tao-Yuan Hsien, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 55/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polishing (CMP) system includes a wafer polishing unit producing a used slurry; a slurry treatment system for receiving and treating the used slurry to thereby produce an extracted basic solution; and a post-CMP cleaning unit utilizing the extracted basic solution to wash a polished wafer surface. The post-CMP cleaning unit includes a plurality of rollers for supporting and rotating a wafer, a brush for scrubbing the wafer, and a spray bar disposed in proximity to the brush for spraying the extracted basic solution onto the polished wafer surface.