Taipei City, Taiwan

Li-Chung Kuo

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li-Chung Kuo. Retrieved from https://idiyas.com/inventor/li-chung-kuo-kk5idh09

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Li-Chung Kuo: Innovator in Semiconductor Packaging

Introduction

Li-Chung Kuo is a prominent inventor based in Taipei City, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly notable for its impact on the efficiency and reliability of semiconductor devices.

Latest Patents

Li-Chung Kuo holds a patent for a semiconductor package and method. This patent describes a semiconductor package that includes one or more dam structures and outlines the method of forming these structures. The design features an interposer, a semiconductor die bonded to the first side of the interposer, and an encapsulant that encircles the semiconductor die. Additionally, the package includes a substrate bonded to the second side of the interposer, underfill between the interposer and the substrate, and dam structures on the substrate. The dam structures are strategically placed adjacent to the corners of the interposer and are in direct contact with the underfill. Notably, the coefficient of thermal expansion of these dam structures is smaller than that of the underfill, enhancing the package's performance.

Career Highlights

Li-Chung Kuo is associated with Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His work at this esteemed organization has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Li-Chung Kuo has collaborated with notable colleagues, including Jian-You Chen and Kuan-Yu Huang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Li-Chung Kuo's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and collaborative efforts highlight his role as a key figure in advancing semiconductor solutions. His work continues to influence the industry and pave the way for future developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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