Aurora, CO, United States of America

Lexi Wightman

This inventor holds 1 USPTO granted patent. Top assignee: Tension International, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lexi Wightman. Retrieved from https://idiyas.com/inventor/lexi-wightman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lexi Wightman and an Innovation in Item Packaging.

Introduction

Lexi Wightman is an inventor associated with Aurora, Colorado, and Tension International, Inc. Her patent work addresses automated packaging, with a design intended to size packages both longitudinally and laterally.

Latest Patents

Wightman is associated with 1 patent: “Item Packaging Machine with Longitudinal and Lateral Package Sizing.” The invention describes a packaging machine with conveyor modules for induction, height sizing, package drawing, and width trimming, along with two sealing assemblies. A gripper engages the package’s unsealed side and pulls it laterally across the width-trim conveyor to a position corresponding to the order’s width. A second sealing assembly then cuts and seals that side. The design combines package sizing and sealing in an automated process.

Career Highlights

Wightman’s listed patent highlights her contribution to packaging machinery and automated order fulfillment. The invention focuses on adjusting package dimensions to better match an order, while integrating the adjustment with conveyor movement and sealing operations.

Collaborations

Wightman’s listed coworkers include Sameer Kurane and Nicholas Long. The patent is associated with Tension International, Inc.

Conclusion

Lexi Wightman’s patent presents an integrated approach to sizing and sealing packages, reflecting her work in automated packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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