Lewis S Goldman

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2004-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lewis S Goldman. Retrieved from https://idiyas.com/inventor/lewis-s-goldman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 2

% Patents Active = 50.0

Average Co-Inventor Count = 10.0

ph-index = 2

Forward Citations = 10(Granted Patents)

Company Filing History:

2 out of 166,425

International Business Machines Corporation

patents

Years Active: 2004-2005

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2 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6964885 - Stress resistant land grid array (LGA) module and method of forming the same (2005-11-15),

2. 6703560 - Stress resistant land grid array (LGA) module and method of forming the same (2004-03-09),

Title: Lewis S Goldman - Pioneering Inventor from Bedford, NY

Introduction: Lewis S Goldman is a renowned inventor hailing from Bedford, NY, known for his groundbreaking contributions to various industries.

Latest Patents: Lewis S Goldman holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Lewis S Goldman has worked with top research institutions and companies to bring his inventions to life, revolutionizing the way we interact with everyday products.

Collaborations: Throughout his career, Lewis S Goldman has collaborated with leading universities, tech companies, and research institutions, fostering a culture of innovation and creativity in every project he undertakes.

Conclusion: Lewis S Goldman's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]