Austin, TX, United States of America

Lewis M Eyman


Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 114(Granted Patents)


Location History:

  • Austin, TX (US) (2002 - 2003)
  • Pflugerville, TX (US) (2003)

Company Filing History:


Years Active: 2002-2003

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3 patents (USPTO):Explore Patents

Title: Innovator Lewis M Eyman: Pioneering Thermal Solutions

Introduction

Lewis M Eyman, an inventive mind based in Austin, TX, has made significant contributions to thermal management technology with his innovative solutions. Holding three patents, Eyman has focused on developing advanced heat transfer apparatuses that enhance the performance and reliability of electronic devices.

Latest Patents

Eyman's most recent patents include a **Heat Sink Subassembly**, which is designed to improve the secure coupling of heat sinks to retainers through a uniquely configured force-generating device. This innovative approach allows the heat sink, featuring various fin lengths, to maintain its position effectively, ensuring optimal thermal performance.

Another notable patent is the **Removable Heat Transfer Apparatus for a Pin Grid Array (PGA) Device**, which details a heat transfer system for coupling to PGA devices in sockets mounted on printed circuit boards. This invention integrates a thermally conductive heat sink and an innovative spring clip that facilitates easy installation and removal, showcasing Eyman's commitment to practical engineering solutions.

Career Highlights

Eyman currently works at AMD (Advanced Micro Devices), a leading company in the semiconductor industry. His work has revolved around enhancing thermal management strategies for integrated circuits, which are crucial for maintaining performance in computing devices. Eyman's dedication to improving technology has made a notable impact in the field.

Collaborations

Throughout his career, Eyman has collaborated with talented individuals such as Roger Q Paulsel and Stanley O Sharp. Their combined expertise fosters an environment of innovation, contributing to the development of cutting-edge technologies in thermal solutions.

Conclusion

Lewis M Eyman exemplifies the spirit of innovation within the tech industry. With his patented inventions focusing on heat management, Eyman continues to enhance product performance and reliability, solidifying his place as a respected inventor in the field of thermal technologies. His efforts, alongside collaborative endeavors, pave the way for future advancements in electronic design and integration.

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