This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1981.
Company Filing History:
Years Active: 1981
Title: Lewis K Schultz: Innovator in Semiconductor Cooling Technology
Introduction
Lewis K Schultz is a notable inventor based in Sayre, PA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of cooling solutions for integrated circuits. His innovative approach has led to advancements that enhance the performance and reliability of semiconductor devices.
Latest Patents
One of Schultz's key patents is titled "Restorable backbond for LSI chips using liquid metal coated dendrites." This patent describes an improved arrangement for cooling module-packaged semiconductor integrated circuit chips that contain heat-generating microcircuits. The invention utilizes an interfacial layer of liquid metal alloy coated metallic dendrites, which is sandwiched between the chip and a heat sink. This design allows for enhanced cooling compared to prior art techniques. The patent also includes biasing means that urge the dendritic projections into engagement with the liquid metal alloy layer, forming a unitary heat transfer path from the chip to the module container.
Career Highlights
Lewis K Schultz is associated with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in semiconductor technology. His work has been instrumental in developing solutions that address the challenges of heat management in integrated circuits.
Collaborations
Throughout his career, Schultz has collaborated with notable colleagues, including Robert Babuka and Robert E Heath. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Lewis K Schultz's contributions to semiconductor cooling technology exemplify the impact of innovative thinking in engineering. His patent on liquid metal coated dendrites represents a significant advancement in the field, showcasing his dedication to improving the performance of integrated circuits.