Company Filing History:
Years Active: 1999
Title: Leszek Dariusz Wronski: Innovator in High-Speed Switch Packaging
Introduction
Leszek Dariusz Wronski is a notable inventor based in Dayton, OH, who has made significant contributions to the field of electrical engineering. His innovative work focuses on enhancing the efficiency of electrical paths through compact packaging solutions.
Latest Patents
Wronski holds a patent for a high-speed switch package that provides reduced path lengths for electrical connections. This invention features a compact design that utilizes a printed circuit board switch backplane to support a switching subsystem. The arrangement connects the subsystem to pairs of electrical connectors positioned on opposite edges of the backplane. The design minimizes trace lengths by routing signals to the nearest connectors, resulting in a star or radiating pattern of trace paths that enhances performance.
Career Highlights
Leszek Dariusz Wronski is currently associated with Systran Corporation, where he applies his expertise in electrical engineering to develop advanced technologies. His work has been instrumental in creating solutions that improve the efficiency and reliability of electrical systems.
Collaborations
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Conclusion
Leszek Dariusz Wronski's contributions to high-speed switch packaging exemplify the innovative spirit that drives advancements in electrical engineering. His patent reflects a commitment to improving technology and efficiency in electrical systems.