Systran Corporation

Leszek Dariusz Wronski

A compact, high speed switch packaging arrangement or package provides reduced path lengths for electrical paths through the package. In particular, a printed circuit board switch backplane supports a switching subsystem and connects the switching subsystem to pairs of electrical connectors with the pairs of connectors being positioned on opposite edges of the same side of the backplane. A plurality of port boards for processing signals to be switched by the switching subsystem each include pairs of connectors which intermate with the pairs of connectors on the backplane. Port circuitry on the port boards is connected to the port board connectors to minimize trace lengths on the port boards by routing ports to the nearest one of the two connectors. The port boards are mounted to the backplane such that signals from the port boards are routed to the switching subsystem from two opposite sides of the switching subsystem. This routing results in a star or radiating pattern of trace paths on the backplane to reduce trace lengths. Further, since the connectors on the backplane are placed on opposite sides of the switching subsystem, the port boards coupled with the connectors can extend over and above that portion of the backplane which supports the switching subsystem thereby placing the connectors as close as possible to the switching subsystem and, in turn, further reducing trace lengths on the backplane.

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Dayton, OH, United States of America

Leszek Dariusz Wronski